We, NIKKA SEIKO propose a precise holding/bonding of a workpiece by “Temporary Adhesives” which hold/fix strongly during processing and enable to be removed after processing.
In grinding, polishing, cutting and dicing process, it is required that a work piece can be held strongly against the processing force and can be removed easily after processing.
NIKKA SEIKO realized this strong hold during processing with a removable adhesives and calls this adhesion “Temporary Adhering”.
Holding a work piece by temporary adhesives has an advantage that it gives less warpage to the work piece compared to general mechanical holding. Currently, this holding method “Low warpage holding”has become important element technology, paticularly in the field of precison processing.
We have been carrying out various product developments together with many users and releasing various temporary adhesives on the markets since NIKKA SEIKO started selling hot melt type adhesives, melted by heats, in 1968.
In 2014, our technology and high market share in niche sectors of temporary adhesives were recognized and selected as “Global Niche Top Companies Selection 100” by the Ministry of Economy, Trade and Industry (METI) of Japan. We continue to contribute to the field of precision processing in the world.
Temporary adhesives created by NIKKA SEIKO has wide application fields and used for various processing such as semiconductor wafers, electronic parts, ceramics, optical glass, metal materials, etc. As the result, we have the accumulated know-how.
If you have any concerns about holding a workpiece and processing quality, please contact NIKKA SEIKO.
We will propose the best solution to you.