EPOXY ADHESIVES
2 component type epoxy adhesives designed for slicing
semiconductor ingots. Easy to remove by hot water or
designated remover.
W, Q, U, B BOND
Two-component type epoxy adhesives for slicing ingots or blocks. They are removable by hot water. Many types such as quick cure type and strong adhesion type are available for your process. Mixing ratio of resin and hardener is 1:1 or 2:1.
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