EPOXY ADHESIVES
Two-component type epoxy adhesives designed for slicing mono / multi silicon, compounds and oxide ingots. It has strong adhesive strength at room temperature. Can be removed by hot water or the dedicated removing agents.
W, Q, U, B BOND
Two-component type epoxy adhesives for slicing ingots or blocks. They are removable by hot water. Many types such as quick cure type and strong adhesion type are available for your process. Mixing ratio of resin and hardener is 1:1 or 2:1.
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